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Showing posts with label ANADIGICS. Show all posts
Showing posts with label ANADIGICS. Show all posts

Tuesday, August 20, 2013

LG's New G2 Smartphone Utilizes ANADIGICS' 5 GHz 802.11ac FEIC, Which Leverages Patented InGaP-Plus technology to Help Reduce Time-to-Market, Minimize Space Requirements, and Achieve Greater Throughput

Aug. 15, 2013 -- ANADIGICS, Inc. (Nasdaq:ANAD) (the "Company"), a world leader in radio frequency (RF) solutions, today announced that the Company's AWL9581 front-end integrated circuit (FEIC) enables 5 GHz 802.11ac WiFi connectivity in the new G2 by LG Electronics. This feature-rich smartphone offers a 5.2-inch Full HD IPS display, 13 megapixel camera, 2.26 GHz quad-core processor, and Android(R) 4.2.2 Jelly Bean operating system.

"We are thrilled that our 802.11ac WiFi front-end IC is powering the sleek and innovative G2 smartphone by LG Electronics," said Jonathan Griffith, vice president of WiFi Products at ANADIGICS. "Our 802.11ac WiFi solutions have set the standard in FEIC form, fit and function by combining industry-leading efficiency for longer battery-life and world-class linearity for greater throughput in a highly integrated, space-saving package. Our value as a critical enabler for the newest-generation of WiFi-enabled devices is demonstrated by our inclusion on leading reference designs and strong traction at top-tier OEMs."

ANADIGICS' AWL9581 5 GHz FEIC leverages the Company's exclusive InGaP-Plus(TM) technology and patented design architectures to combine a high performance power amplifier (PA), low-noise amplifier (LNA), and RF switch on a single die. This level of integration greatly improves manufacturability and reliability, while reducing PCB space requirements and simplifying RF front-end design to speed time-to-market. The complete family of 802.11ac FEICs provides outstanding error vector magnitude (EVM) and noise figure performance, which enables ultra-high data throughput.

ANADIGICS 802.11ac WiFi FEIC Family Key Facts and Highlights:

  --  Ultra-low EVM in the toughest 802.11ac modulation formats, enabling extremely high transmission data rates
  --  Best-in-class power efficiency for improved thermal characteristics to support MIMO applications
  --  Industry-leading integration of the PA, LNA, and Tx/Rx switch to simplify RF design and reduce time-to-market
  --  Compact 2.5 mm x 2.5 mm x 0.4 mm QFN package with a high-accuracy integrated power detector, and RF ports internally matched to 50 Ohms to reduce PCB space requirements

For more information on ANADIGICS products and multimedia content, please refer to the following resources:
  --  ANADIGICS LinkedIn: http://www.linkedin.com/company/anadigics
  --  ANADIGICS Facebook: http://www.facebook.com/anadigics
  --  ANADIGICS Twitter: http://www.twitter.com/anadigics
  --  ANADIGICS Photos: http://www.flickr.com/anadigics_inc
  --  ANADIGICS Video: http://www.youtube.com/anadigics

Wednesday, May 29, 2013

ANADIGICS Introduces New Family of 802.11ac WiFi Power Amplifiers


ANADIGICS' New Power Amplifiers, Optimized for Infrastructure and Multimedia Applications, Offer Exceptional Gain, Output Power, and Linearity to Enable Ultra-High Throughput at Extended Ranges

 WARREN, N.J., May 29, 2013 (GLOBE NEWSWIRE) -- ANADIGICS, Inc. (Nasdaq:ANAD), a world leader in radio frequency (RF) solutions, today introduced a new family of 802.11ac power amplifiers (PAs) optimized for WiFi infrastructure and multimedia applications, including access points, routers, media gateways, set-top boxes, and smart TVs. These power amplifiers deliver an industry-leading combination of high gain, output power, and linearity to maximize data throughput and ensure reliable transmission of high definition (HD) video at extended ranges. The Company's new 802.11ac solutions also feature greater integration compared with a typical power amplifier, reducing external component requirements and saving valuable PCB space.

 "ANADIGICS continues to set the RF performance standard for WiFi applications," said Dave Cresci, vice president of WiFi Products at ANADIGICS. "Our latest power amplifiers stand out as critical enablers in the expanding use of 802.11ac MIMO technology for WiFi infrastructure in both commercial and residential applications. They complement and build upon the success of our highly integrated front-end ICs by offering exceptional gain, output power and linearity to deliver higher data rates at greater ranges for an enhanced computing and multimedia user experience."

ANADIGICS' new family of WiFi power amplifiers leverage the Company's exclusive InGaP-Plus(TM) technology and patented design architectures to offer world-class performance and integration. The first product in this family is the AWL5905 power amplifier, which offers 29 dB of gain and is optimized for 5 GHz WLAN standards, including 802.11a/n/ac. The AWL5905 features an integrated detector that facilitates accurate power control over varying load conditions (3:1 VSWR), as well as a digital PA enable interface that improves ease of use and eliminates the requirement for an external buffer amplifier. This level of integration includes internal RF matching and is provided in a compact, low-profile 4 mm x 4 mm x 0.8 mm surface-mount package that significantly reduces PCB space requirements. ANADIGICS' AWL5905 also combines world-class efficiency and thermal performance, enabling manufacturers to develop multiple input multiple output (MIMO) solutions that consume less power and are more thermally efficient.

 ANADIGICS 802.11ac WiFi Power Amplifier Family Key Facts and Highlights:

   --  High gain and output power levels to ensure optimal performance in infrastructure and multimedia applications
   --  Ultra-low EVM in the toughest 802.11ac modulation formats, enabling extremely high transmission data rates
   --  High-accuracy, integrated power detector to ensure accurate power control over varying load conditions
   --  CMOS-compatible enable voltage to improve ease of use
   --  Compact 4 mm x 4 mm x 0.8 mm QFN package with RF ports internally matched to 50 Ohms and DC blocked to reduce PCB space requirements
   --  Best-in-class power efficiency for improved thermal characteristics to support MIMO applications