AMD發佈擴展伺服器記憶空間新技術

AMD Unveils Forward-Looking Technology Innovation To Extend Memory Footprint for Server Computing

KUALA LUMPUR, MALAYSIA. — July 25, 2007 — Responding tocustomer and industry demand for increasingly improved system memorycapabilities and choice, AMD (NYSE: AMD) today announced it collaboratedwith leading integrated circuit (IC) companies to develop the Socket G3Memory Extender (G3MX) technology, which is planned for the AMDOpteron™ processor platform infrastructure ecosystem in 2009.

This innovative platform-level technology is designed to extend the total memoryfootprint in future AMD Opteron processor-based systems and, therefore,enable increased performance to customers’ enterprise-class servers, such asthose used for databases and emerging technologies like virtualization andmulti-core computing. Supporting the DDR3 memory specification fromJEDEC1, G3MX technology is being developed in collaboration with IDT andInphi, who are planning to sell G3MX components as part of their power- andcost-effective device portfolios supporting the memory industry.“AMD’s competitive edge lies with responding to our customers’requirements now and in the future,” said Randy Allen, corporate vicepresident, Server/Workstation Division, AMD. “As we look ahead to pervasivequad-core and octal-core server computing, AMD is committed to deliveringthe flexibility and choice our customers desire to successfully deployvirtualization and multi-core environments.

True to our collaborative nature,we worked closely with memory technology experts to develop G3MX, as aneasy, cost-effective way for customers to attain faster access to memory oradditional memory to enable increased performance for complex andemerging applications and environments.”

“AMD and its platform partners have developed an innovativetechnology that directly addresses the need for efficient and cost-effectivememory capability, which is one of the most significant computingrequirements of the scientific community,” said Thomas Zacharia, associatelaboratory director of Computing and Computational Sciences, Oak RidgeNational Laboratory.

“The extended platform memory capabilities expectedvia AMD's upcoming G3MX memory technology should allow the use of biggermemory capacities with industry-standard DIMMs for large workloads toultimately help to advance scientific research and discovery.”To create G3MX technology, AMD worked closely with the memorytechnology community to address the complex issues vexing customerstoday. With G3MX, AMD can enable a DDR3-based means of increasing totalmemory in a server system for ultimate flexibility.

“G3MX technology opens new opportunities and options for IDT tocontinue the company’s leadership in advanced memory interface solutions,”said Jimmy Lee, senior vice president and general manager for the IDTtiming solutions group. “By establishing an easy and affordable way toincrease the total memory footprint, AMD has again established itself as avaluable partner in the industry.”“AMD’s customer-centric innovations continue to prove time and againwhy AMD is one of our most strategic technology partners,” said Young K.Sohn, president and CEO, Inphi Corporation.

“G3MX can unlock the memorymystery of running high-performing enterprise-class server applications inenvironments such as virtualization and multi-core computing. By addressingthis issue, we can provide our customers with solutions that support theircritical business needs.”AvailabilityG3MX is expected to be available in 2009 when AMD introduces itsnext-generation architecture enhancements.