Qualcomm to Showcase New Advances in Mobile Technology

Company Introduces New ‘Smartbook’ Vision as Device Manufacturing Partners Demonstrate Groundbreaking Capabilities of Mobile Devices based on Snapdragon

Kuala lumpur — June 1, 2009 — Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies, products and services, will be unveiling new advances in mobile connectivity and capabilities powered by its Snapdragon™ platform at the COMPUTEX TAIPEI 2009 show, taking place June 2-6, 2009. The Company’s device manufacturing partners will be showcasing a wide range of devices powered by Snapdragon chipsets. Qualcomm also will be sharing its vision for a new category of mobile devices called ‘smartbooks’ that bring a new level of always-on connectivity, ultra-portability and powerful performance to mobile users. The Company will be holding a press conference to highlight these new devices and discuss its smartbook strategy on Monday, June 1 at 3:30 PM.

“Consumers are looking for devices that offer more instantaneous connectivity, greater mobile performance and intuitive usability than ever before,” said Luis Pineda, senior vice president of marketing and product management at Qualcomm CDMA Technologies. “Qualcomm’s Snapdragon platform is addressing those needs by enabling smartphones that break new ground in mobile capability, and establishing this new category of smartbooks – devices which deliver a unique mobile user experience different from anything else on the market today.”

Demonstrations available for viewing by appointment include Snapdragon-based devices from ASUS, Compal Communications Inc., Foxconn, High Tech Computer (HTC), Inventec, Toshiba and Wistron.

“HTC has a long history of exceptionally innovative mobile device designs,” said Peter Chou, chief executive officer of HTC. “We feel the Snapdragon platform from Qualcomm holds great promise, and look forward to collaborating on groundbreaking new consumer products that redefine what is possible on a mobile device.”

“The mobile industry is evolving, and it’s become apparent that consumers are more sophisticated in their expectations than ever before,” said Stephen Chen, president of Compal Communications Inc. “The Snapdragon platform’s integrated 3G mobile broadband brings a new level of connectivity and convenience to the smartphone and smartbook categories.”

“Inventec has a strong relationship with Qualcomm, developing new types of mobile products by combining our respective strengths,” said Mark Hirsch, VP Corporate Marketing, Inventec Corp. “Snapdragon chips are making possible an entirely new product category that should have strong appeal to both younger trendsetters and mobile professionals.”

“Quanta has always strived to deliver leading-edge technology to the market,” says Alan Tsai, the senior vice president of Business Group 2 of Quanta Computer Inc. “Thanks to the unprecedented performance of Qualcomm’s Snapdragon chipsets, we look forward to delivering a new type of user experience to the market.”

“Wistron has always prided itself on its innovation and quality leadership within the industry,” said Eric Huang, GM of the Handheld Device BU of the Mobile Business Group at Wistron Corp. “Qualcomm’s new Snapdragon chipsets allow us to offer a variety of innovative mobile devices in creative new form factors with unsurpassed usability and wireless connectivity.”

Smartbooks are a new class of devices running mobile operating systems that bridge the functional divide between smartphones and laptops, delivering the best aspects of a smartphone experience on a larger-display form factor. Constantly connected via 3G, Wi-Fi and GPS, smartbooks are ultra-portable, personalizable, easy-to-use and last all day on a single battery charge. Qualcomm’s Snapdragon platform has a unique combination of capabilities that makes it exceptionally competitive in the smartbook category, which is redefining mobility for consumers at productivity and play. Qualcomm also offers the Plaza Retail™ complete application retail solution, the latest addition to the Plaza solution suite that aims to deliver on Qualcomm’s goal of supporting all major mobile application platforms across a wide variety of devices and networks.
The Snapdragon family includes the original 1 GHz QSD8x50™ chipsets, the new 45-nanometer (nm) 1.3 GHz QSD8650A™ with a wide range of performance and power enhancements, and the QSD8672™ with dual CPUs capable of up to 1.5 GHz for faster response and processing. More than 15 manufacturers are now developing more than 30 Snapdragon-based products.