Next Wave of Ultrabook Devices Now Available with 3rd Generation Intel Core Processors

Industry Players Come Together to Deliver on Vision of No-Compromise Computing Experience

KUALA LUMPUR, June 21, 2012 – Intel Malaysia today unveiled the next wave of Ultrabook™ systems powered by new 3rd generation Intel® Core™ processors. This wave of Ultrabook devices brings Intel Corporation one step closer to delivering on the industry wide, multi-year endeavor to deliver a no-compromise, must-have computing experience. The innovation will continue in the coming years as Intel and its industry partners aim to raise the bar for personal computing experiences, evolving to more natural and intuitive interactions.

Leveraging the 3rd generation Intel® Core™ processors which are made with the world’s most advanced 22nm 3-D tri-gate transistor manufacturing technology, these new Ultrabook devices are even more responsive and more secure to better protect personal information.These new chips have also been designed to offer increased media and graphics performance, and longer battery life.Prakash Mallya, Country Manager, Sales and Marketing, Intel Malaysia holding up and spinning an Ultrabook

“Similar to the introduction of Intel® Centrino® nearly a decade ago, this is a time of revolutionary change in personal computing,” said Prakash Mallya, Country Manager of Sales and Marketing, Intel Malaysia. “More Ultrabooks will be introduced in the next 12 months as compared with the previous. This also includes new business, touch, and convertible designs. At the same time, we’ve continuously improved on security and responsiveness. With these new 3rd generation Intel Core-based Ultrabook devices, mobile computing as we know it today will suddenly seem old fashioned.”(Left to Right) 1. Lee Heng Gee, General Manager of Kulim Microprocessor and Chipset Operations 2. Intel Malaysia Robin Martin, Managing Director of Assembly, Test and Manufacturing, Intel Malaysia 3. David McCloskey, Director of Operations, Asia Pacific, Intel Corp. 4. Prakash Mallya, Country Manager, Sales and Marketing, Intel Malaysia 5. Kamil Hasan, Director of Reseller Channel Organization, Asia Pacific, Intel Corp 6. Chris Kelly, Director of Intel Architecture Group, Intel Malaysia 7. Thomas Soo, General Manager of Penang Assembly and Test, Intel Malaysia

Superior Experiences: Responsive, Stylish, Protected and Mobile
This new wave of Ultrabook devices will wake in a flash, meaning the system will transition from deep sleep (S4 mode) to its active state in less than 7 seconds. Additionally, all Ultrabook devices are now required to be “responsive while active” in that they will load and run users’ favorite apps quickly .

Connecting at blazing speeds is also now possible with the addition of USB 3.0, Thunderbolt™ technology or both. Thunderbolt technology is a high-speed connection that allows incredibly fast transfers. For example, a full-length HD movie can be transferred to an Ultrabook in less than 30 seconds .

Taking into account that security has become an important criteria for consumers, the next wave of Ultrabook systems is equipped with enhanced security features. This includes the Intel® Anti-Theft technology that lets people automatically disable the system if it is lost or stolen .

Better Performance at Lower Power Levels
Taking advantage of the company’s innovative 22nm tri-gate transistor manufacturing technology, Intel engineers have delivered significant improvements in performance for 3rd generation Intel® Core™ processors with up to 22 percent faster performance on multithreaded applications compared to 2nd generation Intel® Core™ processors. For example, experiences when using photo editing software or many games will significantly improve based on the new processors.

The new Ultrabooks have up to twice the video processing and 3-D graphics performance of the prior generation, cutting a user’s video processing time in half and making for a smoother, richer visual experience.

When comparing the graphics and video processing improvements versus a 3 year-old Intel® Core™ 2 Duo-based laptop, there is an up to 30 times improvement in video processing and up to a 19 times improvement in 3-D graphics.

Industry Delivers on No-Compromise Experiences
Conceived by Intel just over a year ago, the Ultrabook category was quickly embraced by the industry. More than 20 systems have been introduced since October 2011, and today momentum is growing with more than 110 3rd generation Intel Core processor-based Ultrabook devices under development.

Intel believes touch capabilities will fuel the industry to innovate and experiment with the style and design of future clamshell and Ultrabook convertible systems. This innovative design, which behaves like a laptop when users need to “create” and acts like a tablet when users want to “consume,” provides people the ultimate flexibility to work smart and play harder. Intel anticipates that around 30 touch-enabled systems, including 10 convertibles, could become available later this year, with the number increasing over time.

Intel is working across a broad cross-section of the industry to accelerate and enable thin and light designs. A recent and significant breakthrough in chassis design using existing materials and standard injection molding equipment will enable an Ultrabook chassis that is equivalent in quality to machined aluminum and die-cast metal solutions in the market today. Borrowing engineering approaches from the automotive and aerospace industries, the new chassis design has the potential to reduce chassis costs by up to 65 percent and is expected to be in market next year.

The introduction of 3rd Gen Intel Core also brings with it significant change to the business world with Intel® Core™ vPro™ and Intel® Small Business Advantage-enabled Ultrabook devices. The next-generation Intel vPro processor platform gives both the business user and IT managers what they want most: security paired with stylish designs, easy automation and new compute models that are both flexible and secure.